Abstract：A modeling method which can establish a 3D electromagnetic field model for the complex interconnect structure for integrated circuits according to circuit design documents is given. In the light of digital or hybrid technology 1PxM integrated circuits, the GDS domains of the circuits are used as the raw material. Using geometry and physical information in the process file, the 3D structure of the chip is able to be restored, so that the electromagnetic field model can be established in ANSYS Q3D. Using this modeling method, it is convenient to analyze the high frequency electromagnetic field precisely and make better combination between integrated circuit design platform and ANSYS analysis platform. It provides a feasible way for electromagnetic compatibility (EMC) of integrated circuits.
王政集,刘詝,粟涛. 基于GDS的数字集成电路电磁场模型提取方法[J]. 电气技术, 2015, 16(9): 11-15.
Wang Zhengji,Liu Zhu,Su Tao. The Extraction Method of the Electromagnetic Field Model in Integrated Circuits based on GDS. Electrical Engineering, 2015, 16(9): 11-15.
2015, Vol. 16 
