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Simulationresearch on thermal analysis of electromagnetic relays |
Li Dan, Zhang Dairun, Yang Lin |
School of Electrical Engineering and Information, Sichuan University, Chengdu 610000; |
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Abstract When a relay is working normally, thetemperatures of its contact system, coil and the metal conductorwill be above a certain range, which will make the mechanical strength of the metal material and the dielectric strength of the insulation material reduce. And all these influences will reduce the service life of the relay greatly. Therefore, it is very necessary to analyze the heat of these components. In this paper, the simulation of electromagnetic relay temperature field is carried out by COMSOL Multiphysics finite element simulation software. By combining with experimental data, the simulation precision is guaranteed and the heat dissipation coefficient of each part is determined. This paper lays the foundation for the simulation study and proves the reliability of the simulation method.
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Received: 23 September 2017
Published: 19 March 2018
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