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Study on thermal resistance measurement methodology of double-sided cooling automotive IGBT module |
LUO Zhexiong1,2, ZHOU Wangjun1,2, LU Jinhui1,2, DONG Guozhong1,2 |
1. Zhuzhou CRRC Times Semiconductor Co., Ltd, Zhuzhou, Hu'nan 412001; 2. The State Key Laboratory of Advanced Power Semiconductor Device, Zhuzhou, Hu'nan 412001 |
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Abstract With new packaging structure, the double-sided cooling (DSC) automotive IGBT has two heat dissipation surface, which is different from traditional IGBT module and requires a new way to acquire its thermal resistance. This article develops dual-TIM thermal resistance measurement methodology, including customized test equipment design, ideal TIM selection, pressing force and test method research, successfully achieves single-side thermal resistance measurement of DSC automotive IGBT. The article analyzes the difference between test results and simulation, and delivers correction route. This novel methodology has good repetitive and generality, which provides the reference for thermal resistance measurement of DSC automotive IGBT modules.
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Received: 18 August 2022
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Cite this article: |
LUO Zhexiong,ZHOU Wangjun,LU Jinhui等. Study on thermal resistance measurement methodology of double-sided cooling automotive IGBT module[J]. Electrical Engineering, 2022, 23(12): 24-30.
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URL: |
http://dqjs.cesmedia.cn/EN/Y2022/V23/I12/24
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