Study on thermal resistance measurement methodology of double-sided cooling automotive IGBT module
LUO Zhexiong1,2, ZHOU Wangjun1,2, LU Jinhui1,2, DONG Guozhong1,2
1. Zhuzhou CRRC Times Semiconductor Co., Ltd, Zhuzhou, Hu'nan 412001; 2. The State Key Laboratory of Advanced Power Semiconductor Device, Zhuzhou, Hu'nan 412001
Abstract：With new packaging structure, the double-sided cooling (DSC) automotive IGBT has two heat dissipation surface, which is different from traditional IGBT module and requires a new way to acquire its thermal resistance. This article develops dual-TIM thermal resistance measurement methodology, including customized test equipment design, ideal TIM selection, pressing force and test method research, successfully achieves single-side thermal resistance measurement of DSC automotive IGBT. The article analyzes the difference between test results and simulation, and delivers correction route. This novel methodology has good repetitive and generality, which provides the reference for thermal resistance measurement of DSC automotive IGBT modules.
[1] 姜昊宇, 张晨, 巫彤宁. 电动汽车低频磁场人体暴露安全性研究[J]. 电气技术, 2022, 23(7): 1-6. [2] 曾正. SiC功率器件的封装测试与系统集成[M]. 北京: 科学出版社, 2020. [3] EBADIAN M A, LIN C X.A review of high-heat-flux heat removal technologies[J]. Journal of Heat Transfer, 2011, 133(11): 110801. [4] IRADUKUNDA A C, HUITINK D R, LUO Fang.A review of advanced thermal management solutions and the implications for integration in high-voltage packages[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2020, 8(1): 256-271. [5] 王莉娜, 邓洁, 杨军一, 等. Si和SiC功率器件结温提取技术现状及展望[J]. 电工技术学报, 2019, 34(4): 703-716. [6] 王晓远, 杜静娟. CFD分析车用电机螺旋水路的散热特性[J]. 电工技术学报, 2018, 33(4): 955-963. [7] GILLOT C, SCHAEFFER C, MASSIT C, et al.Double-sided cooling for high power IGBT modules using flip chip technology[J]. IEEE Transactions on Components and Packaging Technologies, 2001, 24(4): 698-704. [8] LIANG Zhenxian, NING Puqi, WANG F, et al.A phase-leg power module packaged with optimized planar interconnections and integrated double-sided cooling[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2014, 2(3): 443-450. [9] MEI Yunhui, LIAN Jiaoyuan, CHEN Xu, et al.Thermo-mechanical reliability of double-sided IGBT assembly bonded by sintered nanosilver[J]. IEEE Transactions on Device and Materials Reliability, 2014, 14(1): 194-202. [10] DENG Erping, ZHAO Zhibin, ZHANG Peng, et al.Study on the method to measure the junction-to-case thermal resistance of press-pack IGBTs[J]. IEEE Transactions on Power Electronics, 2018, 33(5): 4352-4361. [11] CATALANO A P, SCOGNAMILLO C, D’ALESSANDRO V D, et al. Numerical simulation and analytical modeling of the thermal behavior of single-and double-sided cooled power modules[J]. IEEE Transa- ctions on Components, Packaging and Manufacturing Technology, 2020, 10(9): 1446-1453. [12] ZENG Zheng, OU Kaihong, WANG Liang, et al.Reliability-oriented automated design of double-sided cooling power module: a thermo-mechanical-coor- dinated and multi-objective-oriented optimization methodology[J]. IEEE Transactions on Device and Materials Reliability, 2020, 20(3): 584-595. [13] ZHANG Yiming, DENG Erping, ZHAO Zhibin, et al.A physical thermal network model of press pack IGBTs considering spreading and coupling effects[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(10): 1674-1683. [14] 蓝元良, 汤广福, 印永华, 等. 大功率晶闸管热阻抗分析方法的研究[J]. 中国电机工程学报, 2007, 27(19): 1-6. [15] 杨俊, 查鲲鹏, 高冲, 等. 直流换流阀晶闸管热阻抗端口特性分析与建模[J]. 中国电机工程学报, 2016, 36(1): 196-204. [16] 李志刚, 张亚玲, 曹博, 等. IGBT热阻测量方法的综述[J]. 电子元件与材料, 2015, 34(9): 25-30. [17] 窦泽春, 忻兰苑, 刘国友, 等. 压接式IGBT模块的热学特性研究[J]. 机车电传动, 2013(3): 6-9, 29.
2022, Vol. 23 
