Design of Novel Passive Soft Switching Buck Converter
Xia Shouxing1, Mao Xiaoqun2
1. Department of Electronic Engineering, Zhejiang Industry & Trade Vocational College, Wenzhou, Zhejiang 325003; 2. College of applied Electronic, Chongqing College of Electronic Engineering, Chongqing 401331
Abstract:On the main switch current path of Buck converter of large power, a small inductance is connected in order to realize the zero-current switching of the main switch. When the main switch is turned off, the continuous current of the small inductance can be supplied to the cooling fan circuit, which means the electricity energy is transferred to the mechanical energy which is used to cool the power devices in return. At the same time, the speed of the fan is increased in consistent to the power increasing power of the switch. The switching-off of the switch with zero-voltage is realized by LC resonance circuit. The main part of it does not connect with the main circuit path. The inductance of the resonance should be a little larger so as to reduce the peak of current of the resonance. In this paper, the working process of soft switch is analyzed and the selection equation of element parameters is derived. The correctness of circuit design is demonstrated by analysis and experiment.
[1] 李爱文, 张承慧. 现代逆变技术及其应用[M]. 北京: 科学出版社, 2000. [2] Wang C R, Su J H, Yang C H. Improved ZCS-PWM commutation cell for IGBTs application[J]. IEEE Transactions on Aerospace and Electronic Systems, 2004, 40(3): 879-888. [3] Wang C M. New family of zero-current-switching PWM converters using a new zero- current-switching PWM auxiliary circuit[J]. IEEE Transactions on Industrial Electronics, 2006, 53(3): 768-777. [4] 林国庆, 陈志坚. 基于辅助网络的软开关Buck变换器[J]. 中国电机工程学报, 2010, 30(30): 22-26. [5] 褚恩辉, 金升, 张化光. 一种新型无源软开关变换器[J]. 电子学报, 2010, 38(8): 1963-1968. [6] 陈坚. 电力电子学[M]. 2版. 北京: 高等教育出版社, 2004. [7] 张卫平, 张晓强, 陈振更, 等. 一种新型软开关BUCK变换器[J]. 中国电机工程学报, 2007, 27(22): 110-115. [8] 夏守行, 张佐理. 一种谐振开关电容变换器的再分析与改进[J]. 电工技术学报, 2013, 28(4): 126-132. [9] Narumanchi S, Mihalic M, Kelly K, et al. Thermal interface materials for power electronics appli- cations[C]//2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3, 2008: 395-404.