Abstract：In order to optimize the temperature rise and electromagnetic field of the conductive circuit of the high disconnector, Solidworks is used to establish three-dimensional model and ANSYS workbench is used to simulation analysis. The simulation analysis and performance optimization of the conductive circuit of the GW5 type disconnector was performed based on the electromagnetic field and temperature field. The maximum electromagnetic field strength and the maximum temperature rise appears in the contact finger structure are obtained by simulation calculation. Tungsten copper can greatly reduce the temperature rise to 23.032℃ and chamfered of the all ends can greatly reduce the maximum electromagnetic field strength of the contact finger structure are summed up by changing the material and structure of the contact finger. The performance optimization scheme proposed and the calculation results in this paper could provide theoretical basis for the design of high voltage disconnector in the future.
2017, Vol. 18 
