Simulation and test researches on influence factors of temperature rise in switchgear
Du Li1,2, Ding Yongsheng1,3, Shi Weidong1,2, Liu Jin1,2, Lu Jun1,2
1. Nari Group Corporation State Grid Electronic power Research Institute, Nanjing 211000; 2. Jiangsu Nari Power Electric Co., Ltd, Nanjing 211000; 3. Shanghai Zhixin Electric Co., Ltd, Shanghai 200335
Abstract At present, the temperature rise problem of switchgear is very prominent. In order to reduce the temperature rise of the switchgear, the influence factors of temperature rise of high voltage switchgear are carried out by using the outlet cabinet of KYN96-12 as the research object. The simulation analysis and experimental study were carried out for the switchgear of different ambient temperature, copper bar specifications and conductor materials. The research results show that the initial ambient temperature has less influence on contact temperature rise of switchgear and the difference in temperature rise under 0℃ and 40℃ is less than 1℃. The copper bar specification and the material of circuit breaker’s contact arm have more influence on the temperature rise of the contact, the difference of temperature rise above 3℃when copper bar specification is 80mm×10mm and 120mm×10mm and above 2℃ when the contact arm’s material is aluminum and copper respectively.
Du Li,Ding Yongsheng,Shi Weidong等. Simulation and test researches on influence factors of temperature rise in switchgear[J]. Electrical Engineering, 2018, 19(9): 51-54.
2018, Vol. 19 
