Abstract：Chip lifespan directly affects the reliable operation of DC control and protection devices. Domestic chips equipped with hot carrier injection effect reliability monitoring circuits are still in the early stages of development, with their high temperature sensitivity posing a major challenge for engineering applications. Compensation schemes using external temperature sensors would increase system complexity and software overhead. To address this, this paper proposes a self-sensing calibration method for aging monitoring. It constructs a temperature model by leveraging the strong correlation between the aging-insensitive reference ring oscillator and temperature, enabling real-time correction of the output parameters of the aging-sensitive ring oscillator. This allows for precise monitoring of chip aging without the need for external sensors. Experimental results verify that this method effectively eliminates temperature interference and significantly improves monitoring accuracy, providing a high-integration, low-cost technical approach for the engineering application of domestic reliability monitoring chips.
刘洋, 李宗萱, 李哲, 谢嘉琪, 朱彦磊. 具有芯片寿命监测功能的直流控制保护装置设计方法[J]. 电气技术, 2026, 27(9): 34-40.
LIU Yang, LI Zongxuan, LI Zhe, XIE Jiaqi, ZHU Yanlei. A self-sensing calibration-based method for monitoring chip aging signatures in DC control and protection device. Electrical Engineering, 2026, 27(9): 34-40.
2026, Vol. 27 
