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| Research and application of access solution for self-discovery and configuration-free device based on IEC 61850 |
| DAI Xiaoxiang, LIN Qing, HU Shaoqian |
| NR Electric Co., Ltd, Nanjing 211100 |
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Abstract With the continuous development of digitalization, networking, and intelligence in substation integrated automation systems, the engineering application of communication schemes based on the IEC 61850 standard is becoming increasingly widespread. However, the equipment access engineering implementation process heavily relies on manual configuration methods, which are relatively inefficient and prone to errors. This paper aims to study the self-discovery and configuration- free scheme for substation bay-level equipment, proposing a full-process automated solution covering “self discovery-free configuration-automatic modeling”. Firstly, a solution combining active network scanning and registration notification services is used to automatically discover devices. Subsequently, the file service of IEC 61850 manufacturing message specification (MMS) is used to automatically summon model files. Finally, device addition or model updating is achieved through model validity verification and comparison, completing automatic access and communication. In addition, machine learning and trusted computing technologies are combined to further enhance the accuracy of model information and the security of access. This research provides a feasible technical solution to address the current issues in the engineering application of IEC 61850, effectively improving the implementation efficiency and accuracy of secondary equipment access in IEC 61850 substations. Especially, the addition of client access to existing equipment significantly improves the effectiveness.
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Received: 19 December 2025
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| Cite this article: |
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DAI Xiaoxiang,LIN Qing,HU Shaoqian. Research and application of access solution for self-discovery and configuration-free device based on IEC 61850[J]. Electrical Engineering, 2026, 27(8): 69-74.
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| URL: |
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https://dqjs.cesmedia.cn/EN/Y2026/V27/I8/69
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2026, Vol. 27 
